EP1K30FI256-2N vs EP1K30F256-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FI256-2N sa pamamagitan ng Intel at EP1K30F256-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30FI256-2N | EP1K30F256-3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | ACEX-1K | ACEX 1K |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Maximum User I/O | 171 | — |
| Process Technology | 0.22 µm CMOS | 0.18 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V | — |
| Maximum Internal Frequency | 200 MHz | — |
| Number of LABs | 216 | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | FBGA-256 (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -3 |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Uri ng Memory | Dual-port Embedded Array Block (EAB) | — |
| Logic Elements | — | 1,728 |
| Equivalent Gates | — | 30,000 |
| Configurable Logic Blocks (CLBs) | — | 216 |
| Embedded Memory (RAM bits) | — | 24,576 |
| Maximum User I/O Pins | — | 171 |
| Maksimum na Taktiko ng Oras | — | 909 MHz |
| Core Voltage | — | 1.8 V |
| Configuration Method | — | SRAM (requires external configuration device) |
| JTAG Support | — | Yes (IEEE 1149.1 / IEEE 1532) |
| PLL | — | Yes (on-chip) |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |