EP1S20F672C7N vs EP1S20F672I5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1S20F672C7N sa pamamagitan ng Intel at EP1S20F672I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1S20F672I5N - 18,460 Logic Elements Stratix FPGA, 672-FBGA | Intel
EP1S20F672I5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1S20F672C7N | EP1S20F672I5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix (first generation) | — |
| Family | Stratix | Stratix |
| Logic Elements (LEs) | 18,460 | — |
| Logic Cells | 18,460 | — |
| Configurable Logic Blocks (CLBs) | 2,132 | — |
| Embedded Memory (TriMatrix) | 1,669,248 bits (426 Kbit total) | 1,638,400 bits (1.6 Mbit) |
| DSP Blocks | 56 (dedicated 18x18 multipliers) | Yes (variable-width multipliers) |
| Maximum User I/O | 586 | — |
| I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| PLLs | Up to 12 | Yes (on-chip) |
| Maximum Operating Frequency | 420.17 MHz | 500 MHz (internal logic) |
| Core Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Packhaging | 672-FBGA (FineLine BGA) | 672-ball FBGA (FineLine BGA) |
| Package Body Size | 35 mm x 35 mm | — |
| Ball Pitch | 1.27 mm | 1.0 mm |
| Temperature na Operasyon | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 (-7) | -5 (industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant) | — |
| Configuration Modes | PS, PPS, FPP, JTAG | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 18,460 |
| Operating Temperature (Industrial) | — | -40 C to +100 C ambient |
| Tindminan RoHS | — | Compliant (lead-free FBGA) |