EP1S25F672C5N vs EP1S25F672C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1S25F672C5N sa pamamagitan ng Intel at EP1S25F672C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1S25F672C5N | EP1S25F672C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix | Stratix |
| Series | EP1S25 | Stratix I |
| Logic Elements (Cells) | 25,660 | — |
| Number of CLBs | 2,566 | — |
| Number of Logic Cells / Gates | [DATA_NEEDED: total system gates] | — |
| Process Technology | 130 nm CMOS | CMOS |
| Maximum Internal Frequency | 500 MHz | — |
| Core Supply Voltage | 1.5 V (nominal) | — |
| Number of I/O Pins | 473 user I/O | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Package Type | FineLine BGA (FBGA) | — |
| Package Pin Count | 672 | — |
| Ball Pitch | 1.00 mm | 1.27 mm |
| Hanay ng Temperature na Operasyon | 0 °C to +85 °C (commercial) | — |
| Speed Grade | C5 | — |
| Lead-Free (Pb-Free) | Yes (suffix "N") | — |
| Configuration Method | SRAM-based, programmable via JTAG / Passive Serial / Fast Passive Parallel | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 25,660 |
| Logic Array Blocks (LABs) | — | 2,566 |
| Embedded Memory (bits) | — | 1,944,576 |
| Maximum User I/O | — | 473 |
| Packhaging | — | 672-BBGA / 672-FBGA (FineLine BGA) |
| Package Body Size | — | 35 mm x 35 mm |
| Supply Voltage (Core) | — | 1.5 V |
| Temperature na Operasyon | — | 0 C to +85 C (Commercial) |
| Configuration | — | SRAM-based, requires configuration device |
| Lead-Free | — | Yes |