EP1SGX25CF672C5 vs EP1SGX25DF672C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25CF672C5 sa pamamagitan ng Altera at EP1SGX25DF672C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP1SGX25CF672C5 - 25,660-LE Stratix GX FPGA, 672-FBGA | Altera (Intel)
EP1SGX25CF672C5 ObsoletePagsanggunian na paghahambing
| Parametro | EP1SGX25CF672C5 | EP1SGX25DF672C6 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix® GX | Stratix GX |
| Family | Stratix I GX | — |
| Number of Logic Elements | 25,660 | — |
| Number of LABs/CLBs | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 bits |
| Number of I/O | 455 | — |
| Number of Transceivers | 12 | 6 channels (per Stratix GX family) |
| Number of Embedded Multipliers | 14 (18x18) | — |
| Number of PLLs | 4 | — |
| Core Voltage | 1.425 V to 1.575 V | 1.5 V |
| Temperature na Operasyon | 0°C to +85°C (Commercial) | 0C to +85C (commercial) |
| Packhaging / Kaso | 672-BBGA, FCBGA | — |
| Supplier Device Package | 672-FBGA (27x27 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 0.13 µm CMOS | CMOS |
| Tindminan RoHS | [DATA_NEEDED: rohs_status] | — |
| Logic Elements | — | 25,660 LE |
| Number of LABs | — | 2,566 |
| User I/O Count | — | 455 |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Packhaging | — | 672-BBGA FineLine BGA |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Lead-Free / RoHS | — | Lead-Free (per FBGA suffix family) |