EP1SGX25DF1020C7N vs EP1SGX25DF1020C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF1020C7N sa pamamagitan ng Intel at EP1SGX25DF1020C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1SGX25DF1020C7N - 25,660 LEs Stratix GX FPGA, 1020-FBGA | Intel
EP1SGX25DF1020C7N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP1SGX25DF1020C7N | EP1SGX25DF1020C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | — |
| Number of LABs/CLBs | 2,566 | — |
| Total RAM Bits | 1,944,576 | 1,944,576 |
| Number of I/O | 607 | 607 (614 user pins per datasheet) |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V min, 1.575 V max) |
| Speed Grade | C7 (commercial) | — |
| Temperature na Operasyon | 0 °C to 85 °C | 0 °C to +85 °C (commercial) |
| Package Type | 1020-ball FC-FBGA | 1020-BBGA / FC-FBGA |
| Package Dimensions | 33 mm × 33 mm, 1.0 mm ball pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | Lead-free per datasheet |
| Device Logic Elements | — | 25,660 |
| LABs / CLBs | — | 2,566 |
| Package Size | — | 33 x 33 mm, 1.0 mm pitch |
| Logic Family | — | CMOS |
| Transceivers | — | Embedded multi-gigabit transceivers (3.125 Gbps class) |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, JTAG |