EP1SGX25DF672C5N vs EP1SGX25DF672C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF672C5N sa pamamagitan ng Intel at EP1SGX25DF672C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1SGX25DF672C5N | EP1SGX25DF672C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix GX | Stratix GX |
| Logic Elements | 25,660 LE | 25,660 |
| User I/O Count | 455 | — |
| Total RAM Bits | 1,944,576 bits | — |
| Supply Voltage (Core) | 1.5 V (1.425 V to 1.575 V) | — |
| Transceiver Data Rate | Up to 3.1875 Gbps | — |
| Number of Transceivers | 20 | 4 |
| DSP Blocks | 10 (dedicated 18x18 multipliers) | — |
| Package Type | 672-ball Flip-Chip BGA (FBGA-672) | — |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch | 33 × 33 mm, 1 mm pitch |
| Temperature na Operasyon | 0 C to 85 C (Commercial) | 0 °C to 85 °C (Commercial) |
| Speed Grade | C5 | C7 |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Configuration Modes | PS, PPS, FPP, JTAG | — |
| Uri ng Pagpapasok | Surface Mount (FBGA) | Surface Mount (BGA) |
| Lead Free / RoHS | Lead free per Altera/Intel datasheet | — |
| Embedded Memory | — | 1,944,576 bits |
| Maximum User I/O | — | 455 |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| Core Supply Voltage | — | 1.5 V |
| Packhaging | — | 672-ball FineLine BGA (FBGA-672) |
| Lead-Free / RoHS | — | Yes (lead-free, per datasheet) |
| Tindminan RoHS | — | Compliant |