EP20K100CF324C8 vs EP20K100CF324C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100CF324C8 sa pamamagitan ng Intel at EP20K100CF324C9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100CF324C8 | EP20K100CF324C9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX-20K | APEX 20K |
| Logic Elements | 4,160 | 4160 |
| Typical Gates | 100,000 | 100000 |
| Embedded RAM Bits | 53,248 | — |
| Embedded System Blocks (ESBs) | 26 | — |
| Maximum User I/O | 246 | 246 |
| Packhaging | 324-FBGA (FineLine BGA) | 324-FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.8 V typical | 1.8 V (typical, APEX II) |
| Process Technology | 0.18 µm CMOS | — |
| Speed Grade | C8 (commercial, 8 ns) | -9 (C9) |
| Temperature na Operasyon | 0°C to +85°C (commercial) | 0C to +85C (Commercial) |
| Configuration Interface | JTAG (IEEE 1149.1), serial/parallel | JTAG (IEEE 1149.1) / Passive serial |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL | — |
| Design Software | Quartus II (legacy) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II |
| Uri ng Pagpapasok | — | Surface Mount |
| I/O Voltage Support | — | 2.5 V / 3.3 V |
| Embedded System Blocks | — | Yes (ESB for RAM/ROM/CAM) |
| Lead Free | — | [DATA_NEEDED: lead-free status] |