EP20K100EFC144-1 vs EP20K100ETC144-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K100EFC144-1 sa pamamagitan ng Intel at EP20K100ETC144-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K100EFC144-1 | EP20K100ETC144-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Device Family | APEX 20KE | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| Typical Gates | 100,000 | 53248 |
| Maximum System Gates | 263,000 | — |
| Logic Elements | 4,160 | 4160 cells |
| Embedded System Blocks (ESBs) | Yes (memory + dedicated logic) | — |
| User I/Os | 93 | 92 |
| Propagation Delay | 1.6 ns | 1.6 ns |
| PLLs | 4 | — |
| Package Type | 144-ball FBGA (13x13 mm, 1.0 mm pitch) | TQFP-144 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | 0 °C to 85 °C |
| Process Technology | 0.15-µm all-layer copper | 0.22 µm CMOS all-layer copper |
| Configuration Method | SRAM (volatile) - external boot PROM required | — |
| Boundary-Scan Support | IEEE 1149.1 (JTAG) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (gull-wing) |
| Macrocells | — | 416 |
| Core Voltage | — | 1.8 V |
| Maximum Frequency | — | 250 MHz |
| Speed Grade | — | -1 (slowest bin, "-1X") |