EP20K400FI672-2X vs EP20K300EFI672-2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400FI672-2X sa pamamagitan ng Intel at EP20K300EFI672-2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400FI672-2X | EP20K300EFI672-2X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | APEX 20K | APEX 20KE |
| Logic Elements | 16,640 | — |
| Typical Gates | 400,000 system gates | — |
| Embedded Memory | 212,992 bits | 147,456 bits |
| User I/O Pins | 496 | — |
| Packhaging | 672-ball BGA (FI672) | 672-ball FineLine BGA (FBGA) |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| No. of Terminals | 672 | — |
| Package Shape | Square | — |
| Speed Grade | -2X | -2X (enhanced) |
| Temperature na Operasyon | -40C to +85C (industrial) | -40 °C to +85 °C (industrial) |
| Core Voltage | 1.8 V | — |
| I/O Voltage Support | 1.8V / 2.5V / 3.3V / 5V (MultiVolt) | — |
| Configuration Method | SRAM (serial EPROM or JTAG) | — |
| JTAG Support | Yes (IEEE 1149.1) | — |
| Process Technology | 0.18 um CMOS, 6-metal | 0.22 µm CMOS |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| System Gates | — | 300,000 |
| Logic Elements (Cells) | — | 11,520 |
| User I/Os | — | 408 |
| Maximum Internal Frequency | — | 350 MHz |
| Propagation Delay | — | 1.68 ns |
| Core Supply Voltage | — | 1.8 V |
| Package Pin Count | — | 672 |
| Uri ng Pagpapasok | — | Surface Mount |