EP2A25F672C8N vs EP2A25F672C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C8N sa pamamagitan ng Intel at EP2A25F672C8 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C8N | EP2A25F672C8 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX II | APEX II (EP2A25) |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | — |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | — |
| User I/Os | 492 | — |
| Packhaging | 672-ball FC-FBGA (FineLine BGA) | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | C8 | C8 |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Non-compliant (legacy product) |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements | — | 25,000 (typical gates) |
| Maximum System Gates | — | 40,960 |
| Macrocells / Embedded Logic | — | 2,432 macros |
| User I/O Count | — | 492 |
| Propagation Delay (tpd) | — | 1.69 ns |
| Process Technology | — | 0.15 microm CMOS, 8-layer copper interconnect |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | 1 Gbps |
| PLL Count | — | 4 |
| Embedded Memory | — | ESB blocks (dual-port RAM, FIFO, CAM, ROM) |
| I/O Banks | — | 16 |