EP2A40F1020C9N vs EP2A40F1020C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F1020C9N sa pamamagitan ng Intel at EP2A40F1020C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N ObsoletePagsanggunian na paghahambing
| Parametro | EP2A40F1020C9N | EP2A40F1020C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Series | EP2A40 | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Family | CMOS | CMOS |
| System Gates | 1.5 M | 1,500,000 (1.5 M) |
| Logic Cells / Elements | 38,400 | — |
| Maximum Operating Frequency | 366 MHz | — |
| Propagation Delay | 1.55 ns | 1.55 ns |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | — |
| User I/O Pins | 735 | 735 |
| Total Pins | 1020 | — |
| Packhaging | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch, FineLine | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line |
| Temperature na Operasyon | 0 °C to 85 °C | 0 °C to +85 °C (commercial, C7 grade) |
| I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, GTL+, SSTL | — |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG | — |
| On-chip Memory | Embedded System Blocks (ESB) for RAM/ROM | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | unknown | — |
| Technology | — | 0.15 µm all-layer copper CMOS, up to 8 metal layers |
| Logic Elements | — | 38,400 |
| Embedded Memory | — | ESB-based, 504 Kbits total |
| Maximum Internal Performance | — | 562 MHz |
| PLLs | — | 4 |
| Clock Networks | — | 12 |
| True-LVDS Data Rate | — | 1 Gbps |
| Supported I/O Standards | — | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL |
| Core Supply Voltage | — | 1.5 V nominal (1.425 V – 1.575 V) |
| Terminal Form | — | BGA ball (flip-chip) |