EP2A40FB724C8 vs EP2A40B724C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40FB724C8 sa pamamagitan ng Intel at EP2A40B724C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40FB724C8 | EP2A40B724C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | APEX II | APEX II |
| Device Logic Elements | 38,400 | — |
| Typical Gates | 40,000 | — |
| Total RAM Bits | 655,360 | 655360 |
| User I/O Pins | 540 | — |
| Core Voltage | 1.425 V to 1.575 V | — |
| Packhaging | 724-BGA (FCBGA), 35 mm x 35 mm | — |
| Speed Grade | -8 | — |
| Temperature na Operasyon | Commercial (0 C to +85 C) per suffix | 0 °C to 85 °C (TJ) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Architecture | MultiCore (LUT + Embedded System Blocks) | — |
| Embedded System Blocks | Configurable dual-port SRAM / CAM / FIFO | — |
| Configuration Mode | JTAG / Passive Serial / Passive Parallel | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status per datasheet] |
| Process Technology | CMOS, SRAM-based | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Device Logic Elements / Cells | — | 38400 |
| Total System Gates | — | ~1.5 M |
| Number of I/O | — | 540 |
| Number of Logic Gates | — | [DATA_NEEDED: exact gate count in cells vs system gates] |
| Core Supply Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Maximum Internal Frequency | — | 376 MHz |
| I/O Standards Supported | — | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) |
| Packhaging / Kaso | — | 724-BBGA, FCBGA (35 x 35 mm) |
| Supplier Device Package | — | 724-BGA |
| Shipping Media | — | Tray |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |