EP2A40FB724C8 vs EP2A40B724I9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40FB724C8 sa pamamagitan ng Intel at EP2A40B724I9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40FB724C8 | EP2A40B724I9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Device Logic Elements | 38,400 | — |
| Typical Gates | 40,000 | — |
| Total RAM Bits | 655,360 | — |
| User I/O Pins | 540 | — |
| Core Voltage | 1.425 V to 1.575 V | 1.5 V |
| Packhaging | 724-BGA (FCBGA), 35 mm x 35 mm | 724-pin FCBGA (FineLine BGA) |
| Speed Grade | -8 | 9 (slower, robust timing margin) |
| Temperature na Operasyon | Commercial (0 C to +85 C) per suffix | -40 °C to +100 °C (industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Architecture | MultiCore (LUT + Embedded System Blocks) | — |
| Embedded System Blocks | Configurable dual-port SRAM / CAM / FIFO | — |
| Configuration Mode | JTAG / Passive Serial / Passive Parallel | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Process Technology | CMOS, SRAM-based | 0.15 µm CMOS |
| Series | — | EP2A40 |
| Logic Elements / Cells | — | 38,400 |
| System Gates | — | 1,500,000 |
| Embedded Memory (bits) | — | 655,360 |
| Temperature Grade Suffix | — | I (industrial) |
| PLLs | — | Up to 4 |
| Maximum User I/O Pins | — | [DATA_NEEDED: exact I/O pin count for EP2A40B724 package] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |