EP2A70B724I7 vs EP2A70F1508C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70B724I7 sa pamamagitan ng Intel at EP2A70F1508C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70B724I7 - APEX II FPGA 3M Gates 67200 Cells 420MHz 1.5V 724-FCBGA | Intel
EP2A70B724I7 Obsolete
Pagsanggunian na paghahambing
| Parametro | EP2A70B724I7 | EP2A70F1508C7N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 67200 | — |
| Maximum System Gates | 3 M | — |
| Embedded Memory | [DATA_NEEDED: ESB bits - 429 Kb or similar] | — |
| Maximum User I/O Pins | approximately 422 (724-pin FCBGA) | — |
| Process Technology | 0.15 um CMOS | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| PLL Blocks | 4 | — |
| True-LVDS Channels | 8 | — |
| Maximum Internal Frequency | 420 MHz | — |
| Packhaging | 724-pin FCBGA (FineLine BGA) | 1508-pin FC-FBGA |
| Operating Temperature Grade | Industrial (-40 C to +100 C case) | — |
| Configuration Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISP | — |
| Tindminan RoHS | [DATA_NEEDED: not stated in provided data] | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | APEX II |
| Technology | — | 0.15 µm CMOS |
| Core Voltage | — | 1.5 V |
| Logic Cells | — | 67,200 cells |
| Logic Array Blocks | — | 6,720 LABs |
| Total RAM | — | 1,146,880 bits |
| Programmable I/O | — | 1,060 I/O pins |
| Maximum Stated Frequency | — | 420 MHz |
| Gate Capacity | — | 3 million gates |
| Temperature na Operasyon | — | 0°C to 85°C |
| Uri ng Pagpapasok | — | Surface mount |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Thermal Resistance | — | [DATA_NEEDED: thermal resistance] |
| Kuru-kuryente ng Pagbibigay | — | [DATA_NEEDED: supply current] |