EP2A70F1508C9ES vs EP2A70F1508C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70F1508C9ES sa pamamagitan ng Altera at EP2A70F1508C8 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A70F1508C9ES | EP2A70F1508C8 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | — |
| Series | EP2A70 | APEX II (EP2A70) |
| Logic Elements | 67,200 | 67,200 |
| System Gates | 3,000,000 (3M) | — |
| Embedded RAM Bits | 1,146,880 | 1,146,880 |
| User I/O Pins | 1,060 | — |
| Logic Array Blocks (LABs) | 6,720 | — |
| Core Voltage | 1.5 V nominal (1.425 V - 1.575 V) | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 0.15 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 198 MHz | — |
| Propagation Delay | 2.87 ns | — |
| Number of PLLs | 4 | — |
| Packhaging | 1508-ball FC-FBGA (FineLine BGA, flip-chip) | 1508-BBGA, FCBGA (40 x 40 mm) |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0 °C to 85 °C (commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, GTL | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | APEX II |
| User I/O Count | — | 1060 |
| Maximum User I/O Pins | — | 1060 |
| High-Speed Interface Support | — | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| Uri ng Memory | — | Embedded dual-port RAM / ROM via ESBs |
| Architecture | — | Embedded array with LABs + ESBs |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |