EP2AGX125DF25C5G vs EP2AGX125DF25C6G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125DF25C5G sa pamamagitan ng Intel at EP2AGX125DF25C6G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX125DF25C5G | EP2AGX125DF25C6G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GX | Arria II GX |
| Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 118,143 | — |
| Embedded Memory (bits) | 8,315,904 | — |
| User I/O Count | 260 | — |
| Packhaging | 572-BGA, FCBGA | 572-BGA, FCBGA (HBGA) |
| Speed Grade | -C5 (mid-grade) | C6 |
| Process Technology | 40 nm | — |
| Transceiver Count | 12 (up to 6.375 Gbps per channel) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| PCIe Hard IP Blocks | 8 | — |
| DSP Blocks | 9x9 / 18x18 variable-precision | — |
| Memory Interface Support | DDR3 up to 800 Mbps | — |
| PLL Count | 8 | — |
| Global Clock Networks | 48 | — |
| Uri ng Pagpapasok | Surface Mount (FCBGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Temperature na Operasyon | [DATA_NEEDED: commercial vs industrial grade] | [DATA_NEEDED: operating temperature range] |
| Logic Elements (LEs) | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| DSP Blocks (18x18 Multipliers) | — | 260 |
| Number of Logic Elements / Cells | — | 8315904 |
| Total RAM Bits | — | 8315904 |
| Number of Terminals | — | 572 |
| Package Code | — | HBGA |
| Package Shape | — | Square |
| Form of Terminal | — | Ball |