EP2AGX125EF29C5G vs EP2AGX125EF29C6G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29C5G sa pamamagitan ng Intel at EP2AGX125EF29C6G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX125EF29C6G - Arria II GX FPGA, 125K LE, 8.3Mbit, 780-BGA | Intel
EP2AGX125EF29C6G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX125EF29C5G | EP2AGX125EF29C6G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GX | Arria II GX (40 nm) |
| Series | Arria II GX | Arria II GX |
| Logic Elements (LE) | 118,143 | 118,143 |
| Adaptive Logic Modules (ALM) | 49,600 | — |
| Embedded Memory Bits | 8,315,904 | — |
| M9K Block RAM Blocks | 730 | — |
| MLAB Memory | 1,512 Kbits | — |
| 18x18 Multipliers | 590 | — |
| User I/Os | 372 | — |
| I/O Banks | 12 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate (max) | 3.75 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | C5 (commercial) | 6 |
| Packhaging | 780-FBGA (FCBGA, 29x29 mm, 1.0 mm pitch) | 780-BBGA, FCBGA (29 mm) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Embedded Memory | — | 8,315,904 bits (8.3 Mbit) |
| User I/O Count | — | 372 |
| Number of Logic Array Blocks (LABs) | — | 372 (per DigiKey listing parameter) |
| Supply Voltage Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceiver Count | — | Up to 8 multi-gigabit transceivers |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: exact count] |
| PLL Count | — | Up to 8 |
| Configuration Mode | — | FPP, AS, PS, JTAG |
| PCIe Hard IP | — | PCIe Gen1/Gen2 hard controllers |
| Process Node | — | 40 nm TSMC |
| Level ng MSL | — | 3 (per BGA moisture sensitivity norms) |