EP2AGX125EF29I3 vs EP2AGX125EF29C6G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29I3 sa pamamagitan ng Intel at EP2AGX125EF29C6G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX125EF29C6G - Arria II GX FPGA, 125K LE, 8.3Mbit, 780-BGA | Intel
EP2AGX125EF29C6G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX125EF29I3 | EP2AGX125EF29C6G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GX | Arria II GX (40 nm) |
| Logic Elements (LE) | 118,143 | 118,143 |
| Adaptive Logic Modules (ALM) | 49,640 | — |
| Logic Array Blocks (LAB) | 4,964 | — |
| Embedded Memory | 7,892 Kbit (7.93 Mbit) | 8,315,904 bits (8.3 Mbit) |
| User I/Os | 372 | — |
| Number of Terminals | 780 | — |
| Packhaging / Kaso | 780-BBGA, FCBGA | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Supply Voltage na Operasyon | 1.5 V to 3.3 V | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | -3 (I3) | 6 |
| Transceivers | Up to 12 multi-gigabit transceivers | — |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Arria II GX |
| User I/O Count | — | 372 |
| Number of Logic Array Blocks (LABs) | — | 372 (per DigiKey listing parameter) |
| Packhaging | — | 780-BBGA, FCBGA (29 mm) |
| Uri ng Pagpapasok | — | Surface Mount |
| Supply Voltage Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceiver Count | — | Up to 8 multi-gigabit transceivers |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: exact count] |
| PLL Count | — | Up to 8 |
| Configuration Mode | — | FPP, AS, PS, JTAG |
| PCIe Hard IP | — | PCIe Gen1/Gen2 hard controllers |
| Process Node | — | 40 nm TSMC |
| Level ng MSL | — | 3 (per BGA moisture sensitivity norms) |