EP2AGX125EF35C4G vs EP2AGX95EF35C5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF35C4G sa pamamagitan ng Intel at EP2AGX95EF35C5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel
EP2AGX125EF35C4G ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP2AGX125EF35C4G | EP2AGX95EF35C5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | — |
| Embedded Memory Bits | 8,315,904 | 6,839,296 bit |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 452 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | Yes (Gen1/Gen2) |
| Core Voltage | 0.9 V | — |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Technology | 40 nm | 40 nm |
| Packhaging | 1152-ball FC-FBGA (Flip-Chip) | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM-based, PS/FPP/JTAG | — |
| Tindminan RoHS | Compliant | — |
| Speed Grade | C4 | C5 |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Logic Elements (LE) | — | 89,178 |
| User I/O Pins | — | 452 |
| Number of LABs/CLBs | — | 3,747 |
| Supply Voltage (Core) | — | 0.9 V |
| Package Type | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Transceivers | — | Up to 8 (6.375 Gbps) |
| DSP Blocks (18x18 Multipliers) | — | Yes |