EP2AGX125EF35I5N vs EP2AGX260FF35I5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF35I5N sa pamamagitan ng Intel at EP2AGX260FF35I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX125EF35I5N - Arria II GX FPGA 118K LE, 6x 3.125G Transceivers | Intel
EP2AGX125EF35I5N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP2AGX125EF35I5N | EP2AGX260FF35I5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Arria II GX | Arria II GX |
| Device Logic Elements | 118,143 | — |
| Combinational Logic Blocks (CLBs) | 124,100 | — |
| Logic Array Blocks (LABs) | 4,964 | — |
| User I/Os | 452 | — |
| Embedded Memory | 8.4 Mbit (M9K + MLAB) | — |
| DSP Blocks (18x18 Multipliers) | 252 | — |
| Transceivers | 6 (up to 3.125 Gbps) | — |
| PLLs | 4 | — |
| Process Technology | 40 nm CMOS | 40 nm |
| Core Supply Voltage | 0.9 V | — |
| Speed Grade | I5 (industrial, fastest) | — |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Packhaging | 1152-ball FC-FBGA, 35 x 35 mm | 1152-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-Free per MS-034 | — |
| PCI Express Hard IP | Gen1 x1/x4 endpoint | — |
| Configuration Schemes | AS, PS, JTAG, FPP | — |
| Logic Elements | — | 244,188 |
| Embedded Memory (bits) | — | 12,038,144 |
| Adaptive Logic Modules (ALMs) | — | 10260 |
| User I/O Count | — | 612 |
| Transceiver Channels | — | 8 |
| Transceiver Max Data Rate | — | 6.375 Gbps |
| Core Voltage | — | 0.9 V |
| Level ng MSL | — | 3 (168 hours) |
| Tindminan RoHS | — | Compliant |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLL Count | — | [DATA_NEEDED: PLL count] |