EP2AGX190FF35I5G vs EP2AGX260FF35C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX190FF35I5G sa pamamagitan ng Intel at EP2AGX260FF35C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX190FF35I5G | EP2AGX260FF35C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 181,165 | — |
| Embedded Memory Bits | 10,177,536 | 12,038,144 |
| Total RAM Bits | 10,177,536 | — |
| User I/O Count | 612 | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Number of Gates | [DATA_NEEDED: gate count equivalent] | — |
| Number of Transceivers | 12 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Package Type | 1152-BBGA, FC-FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +100C (Industrial) | Commercial (0C to +85C junction) |
| Uri ng Memory | Embedded SRAM | — |
| ALM Architecture | 8-bit Adaptive Logic Module | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Compliance | [DATA_NEEDED: REACH compliance] | — |
| Device Logic Elements | — | 244,188 |
| Logic Array Blocks (LABs) | — | 10,260 |
| Embedded 18x18 Multipliers | — | 612 |
| Maximum User I/O | — | 612 |
| User I/O Banks | — | 12 |
| Packhaging | — | 1152-ball FC-FBGA (FF35), 35 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial) |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Multi-gigabit transceivers, up to 6.375 Gbps |
| PCIe Hard IP | — | PCIe Gen2 x1/x4/x8 (per Arria II GX family) |