EP2AGX260FF35C4N vs EP2AGX260FF35C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260FF35C4N sa pamamagitan ng Altera at EP2AGX260FF35C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2AGX260FF35C4N - Arria II GX 244K LE FPGA, 612 I/O, FCBGA-1152
EP2AGX260FF35C4N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX260FF35C4N | EP2AGX260FF35C4 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 244,188 | — |
| Embedded Memory Bits | 12,038,144 | 12,038,144 |
| Maximum User I/O | 612 | 612 |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate (max) | 5 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | -4 | C4 (commercial) |
| Temperature na Operasyon | Commercial (0C to +85C) | Commercial (0C to +85C junction) |
| Packhaging | 1152-ball FC-FBGA | 1152-ball FC-FBGA (FF35), 35 mm |
| Package Type | FBGA (Fine-pitch BGA, flip-chip) | — |
| Package Code | HBGA | — |
| Uri ng Pagpapasok | Surface Mount (SMT) | Surface Mount (BGA) |
| Programmable Logic Device Type | FPGA | — |
| Hardened PCIe IP | PCI Express Gen2 x1/x4 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Logic Elements | — | 244,188 |
| Logic Array Blocks (LABs) | — | 10,260 |
| Embedded 18x18 Multipliers | — | 612 |
| User I/O Banks | — | 12 |
| Process Node | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Multi-gigabit transceivers, up to 6.375 Gbps |
| PCIe Hard IP | — | PCIe Gen2 x1/x4/x8 (per Arria II GX family) |