EP2AGX260FF35I5G vs EP2AGX260FF35I5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260FF35I5G sa pamamagitan ng Intel at EP2AGX260FF35I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX260FF35I5G | EP2AGX260FF35I5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Arria II GX | Arria II GX |
| Device Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 96,330 | 10260 |
| Embedded Memory Bits | 12,038,144 bits | — |
| User I/O Pins | 612 | — |
| Embedded 18x18 Multipliers | 768 | — |
| Transceiver Channels | 12 | 8 |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Maximum Internal Frequency | 500 MHz | — |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 1152-ball FC-FBGA (FF35), 35 mm body | 1152-ball FC-FBGA |
| Process Technology | 40 nm TSMC | 40 nm |
| Temperature na Operasyon | -40C to +100C (Industrial, I5 grade) | -40C to +100C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 244,188 |
| Embedded Memory (bits) | — | 12,038,144 |
| User I/O Count | — | 612 |
| Transceiver Max Data Rate | — | 6.375 Gbps |
| Level ng MSL | — | 3 (168 hours) |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLL Count | — | [DATA_NEEDED: PLL count] |