EP2AGX45CU17I3G vs EP2AGX45CU17C6G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45CU17I3G sa pamamagitan ng Intel at EP2AGX45CU17C6G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45CU17I3G | EP2AGX45CU17C6G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | — |
| Logic Elements | 42,959 | 42,959 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | 3,517,440 |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | Multi-gigabit transceivers up to 3.75 Gbps |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 358-ball UBGA (FCBGA), 17x17 mm | 358-LFBGA (FCBGA) |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | Lead free / RoHS Compliant |
| Device Family | — | Arria II GX |
| User I/O Count | — | 156 |
| Core Voltage | — | 0.9 V |
| Operating Frequency | — | up to 400 MHz |
| Volte ng Pagbibigay | — | 0.9 V core |
| Number of Terminals | — | 358 |
| Terminal Form | — | Ball (BGA) |
| Package Code | — | LFBGA |
| Package Shape | — | Square |