EP2AGX45DF29C6G vs EP2AGX45DF29I3NAD Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29C6G sa pamamagitan ng Intel at EP2AGX45DF29I3NAD sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29C6G | EP2AGX45DF29I3NAD |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Arria II GX | — |
| Family | Intel FPGA (formerly Altera) | Arria II GX |
| Logic Elements (LE) | 45,000 | — |
| Embedded Memory Bits | 3,517,440 | — |
| User I/O Count | 364 | — |
| DSP 18x18 Multipliers | 312 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | — |
| Packhaging | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FBGA (FineLine BGA) |
| Speed Grade | C6 (commercial, mid-speed) | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Process Node | 40 nm TSMC low-power | 40 nm |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Hard IP Blocks | PCIe Gen1/Gen2, External Memory Controller | — |
| Configuration | SRAM-based, volatile | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Level ng MSL | 3 (168 hours) | — |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |
| Core Voltage | — | [DATA_NEEDED: VCCINT typical value] |