EP2AGX65DF25C5N vs EP2AGX65DF25I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF25C5N sa pamamagitan ng Intel at EP2AGX65DF25I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGX65DF25C5N EP2AGX65DF25I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Arria II GX Arria II GX
Series Arria II GX —
Device Type FPGA (Field Programmable Gate Array) —
Number of Logic Elements (LE) 60214 —
Number of LABs/CLBs 2530 —
Total RAM Bits 5371904 —
Number of I/O 252 —
Package Type FBGA-572 (FineLine BGA, FCBGA, 25 mm) —
Bilang ng Pins 572 —
Volte ng Pagbibigay 0.9 V core; 1.1 V/1.5 V/2.5 V/3.0 V I/O (transceiver analog rails separate) —
Temperature na Operasyon 0C to +85C (commercial, C5 speed grade) —
Speed Grade 5 —
Transceivers Integrated multi-gigabit transceivers (per Arria II GX architecture; channel count [DATA_NEEDED: transceiver channel count for EP2AGX65]) 8 channels
Uri ng Pagpapasok Surface Mount (BGA) —
Tindminan RoHS Compliant (Pb-free) Compliant
Lead-Free Yes Yes
Logic Elements — 60,214
Logic Array Blocks (LABs) — 2,530
Total Embedded Memory — 2,531 Kbits
M9K Memory Blocks — 4.4 Mbits (approx 488 blocks)
MLAB Memory — 1.4 Mbits
Embedded Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Max Transceiver Data Rate — 6.375 Gbps
User I/O Count — 252
Process Technology — 40 nm TSMC
Core Voltage — 0.9 V
Operating Temperature Grade — Industrial (-40C to +100C ambient)
Packhaging — 572-ball FCBGA (flip-chip BGA)
Configuration Modes — AS, PS, FPP, JTAG
Hard IP for PCIe — PCIe Gen1 / Gen2 (x1/x2/x4)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita