EP2AGX65DF25I3N vs EP2AGX65DF25C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF25I3N sa pamamagitan ng Intel at EP2AGX65DF25C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF25I3N - Arria II GX FPGA, 60K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2AGX65DF25I3N | EP2AGX65DF25C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | — |
| Logic Array Blocks (LABs) | 2,530 | 2530 |
| Total Embedded Memory | 2,531 Kbits | — |
| M9K Memory Blocks | 4.4 Mbits (approx 488 blocks) | — |
| MLAB Memory | 1.4 Mbits | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Transceivers | 8 channels | Up to 12 channels, 3.75 Gbps |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| User I/O Count | 252 | — |
| Process Technology | 40 nm TSMC | 40 nm CMOS, low power |
| Core Voltage | 0.9 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C ambient) | — |
| Packhaging | 572-ball FCBGA (flip-chip BGA) | 572-ball FCBGA, 25 x 25 mm (DF25) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Hard IP for PCIe | PCIe Gen1 / Gen2 (x1/x2/x4) | — |
| Tindminan RoHS | Compliant | Lead-free, RoHS compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 60214 |
| Embedded Memory (bits) | — | 5371904 |
| M9K Block Memory | — | 4.5 Mb |
| Distributed RAM | — | 1.4 Mb |
| Embedded 18x18 Multipliers | — | 12 |
| Fractional PLLs | — | 8 |
| Maximum User I/Os | — | 252 |
| PCI Express Hard IP | — | Gen1 x1/x4 |
| Core Voltage (VCCINT) | — | 0.9 V |
| Speed Grade | — | 6 (commercial, slow) |
| Temperature na Operasyon | — | 0 C to +85 C (commercial) |