EP2AGX65DF29I3G vs EP2AGX65DF29C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF29I3G sa pamamagitan ng Intel at EP2AGX65DF29C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel
EP2AGX65DF29C6 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX65DF29I3G | EP2AGX65DF29C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GX | — |
| Family | Arria II | Arria II GX |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 60,214 | 60,214 |
| Embedded Memory Bits | 5,371,904 | — |
| User I/Os | 364 | — |
| Packhaging | 780-BBGA, FCBGA (29mm) | 780-ball FC-FBGA (29x29 mm) |
| Temperature na Operasyon | -40C to +100C (Industrial, I3 speed grade) | Commercial (0C to +85C) |
| Speed Grade | I3 | 6 (C6) |
| Transceivers | Up to 8 channels, 3.75 Gbps (I3 grade) | 8 (up to 3.75 Gbps per Arria II GX family spec) |
| Core Voltage | 0.85V / 1.1V | 0.9 V |
| Process Technology | 40nm TSMC | 40 nm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL Level] | [DATA_NEEDED: MSL level] |
| Configuration Mode | JTAG / Passive Serial / Fast Passive Parallel / EPCS/EPCQ flash | — |
| Logic Array Blocks (LABs) | — | 2,530 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 5,371,904 |
| Maximum User I/O | — | 364 |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | 4 |