EP2AGX65DF29I3N vs EP2AGX65DF29C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF29I3N sa pamamagitan ng Intel at EP2AGX65DF29C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel
EP2AGX65DF29C6 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX65DF29I3N | EP2AGX65DF29C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Arria II GX | — |
| Family | Intel FPGA (formerly Altera Arria II GX) | Arria II GX |
| Process Node | 40 nm TSMC low-power | — |
| Logic Elements (LE) | 60214 | 60,214 |
| Number of LABs/CLBs | 2530 | — |
| Embedded Memory (bits) | 5371904 | 5,371,904 |
| Total RAM Bits | 5,371,904 | — |
| User I/O Count | 364 | — |
| Operating Frequency (max) | 500 MHz | — |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (29x29 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Temperature na Operasyon | -40 C to +100 C (Industrial) | Commercial (0C to +85C) |
| Speed Grade | -3 | 6 (C6) |
| Transceivers | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps | 8 (up to 3.75 Gbps per Arria II GX family spec) |
| Tindminan RoHS | Compliant (Pb-free N suffix) | Compliant |
| Configuration Method | JTAG, Active Serial, Passive Serial, Fast Passive Parallel | — |
| Logic Array Blocks (LABs) | — | 2,530 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Maximum User I/O | — | 364 |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | 4 |
| Process Technology | — | 40 nm |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |