EP2AGZ225FF35C3N vs EP2AGZ225FF35C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35C3N sa pamamagitan ng Intel at EP2AGZ225FF35C3G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35C3N | EP2AGZ225FF35C3G |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | 225,000 |
| Logic Array Blocks (LAB) | 8,960 | — |
| Embedded Memory (bits) | 14,248,960 | — |
| User I/Os | 554 | — |
| Packhaging | 1152-BBGA, FCBGA | 1152-ball Flip-Chip BGA (FF35) |
| Process Node | 40 nm | — |
| Speed Grade | 3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | — |
| Transceivers | Up to 12.5 Gbps | Up to 16 channels |
| DSP Blocks | Yes (variable-precision) | [DATA_NEEDED: count] |
| Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| PCI Express Hard IP | Gen1, Gen2 | Yes (Gen1/Gen2) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Arria II |
| Package Size | — | 35 mm x 35 mm |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Embedded Memory | — | [DATA_NEEDED: Mbits] |
| User I/O Banks | — | [DATA_NEEDED: count] |
| Maximum User I/O | — | [DATA_NEEDED: pin count] |
| Process Technology | — | 40 nm TSMC |
| Memory Controller Support | — | DDR3, DDR2, QDR II+ |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |