EP2AGZ225FF35I3G vs EP2AGX260FF35I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I3G sa pamamagitan ng Intel at EP2AGX260FF35I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
EP2AGX260FF35I3G ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I3G | EP2AGX260FF35I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria II GZ | — |
| Device Family | EP2AGZ | Arria II GX |
| Logic Elements | 225,000 | 244188 |
| Packhaging | 1152-BGA (FBGA, FineLine BGA) | 1152-BBGA, FCBGA |
| User I/O | 554 | — |
| Transceivers | 12 channels | [DATA_NEEDED: number of transceiver channels] |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Memory | 17.4 Mbits | — |
| On-chip RAM | 1,152 Kbits | — |
| Embedded Multipliers | 1,728 18x18 | — |
| PLLs | 8 | — |
| DLLs | 8 | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Voltage | 0.9 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40 C to +100 C (Industrial) |
| Speed Grade | I3 | I3 |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | — |
| Embedded Memory Bits | — | 12038144 |
| Maximum User I/O | — | 612 |
| Core Supply Voltage | — | 0.9 V |
| Configuration | — | JTAG / Active Serial / Passive Serial / FPP |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Lead-Free (RoHS) | — | Yes (G suffix indicates Pb-free finish) |
| Tray Standard Quantity | — | [DATA_NEEDED: tray qty] |