EP2AGZ225FF35I3G vs EP2AGZ225FF35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I3G sa pamamagitan ng Intel at EP2AGZ225FF35I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I3G | EP2AGZ225FF35I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria II GZ | — |
| Device Family | EP2AGZ | — |
| Logic Elements | 225,000 | — |
| Packhaging | 1152-BGA (FBGA, FineLine BGA) | 1152-ball FC-FBGA |
| User I/O | 554 | — |
| Transceivers | 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Memory | 17.4 Mbits | 14,248,960 bits (approx. 14.25 Mbit) |
| On-chip RAM | 1,152 Kbits | — |
| Embedded Multipliers | 1,728 18x18 | — |
| PLLs | 8 | — |
| DLLs | 8 | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Family | — | Arria II GZ |
| Logic Elements (LE) | — | 224,000 |
| Logic Array Blocks (LABs) | — | 8,960 |
| User I/O Count | — | 554 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |
| Maximum User I/O | — | 554 |