EP2AGZ225FF35I3G vs EP2AGZ300FF35I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I3G sa pamamagitan ng Intel at EP2AGZ300FF35I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I3G | EP2AGZ300FF35I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria II GZ | — |
| Device Family | EP2AGZ | — |
| Logic Elements | 225,000 | — |
| Packhaging | 1152-BGA (FBGA, FineLine BGA) | 1152-ball FBGA (FF35) |
| User I/O | 554 | — |
| Transceivers | 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Memory | 17.4 Mbits | — |
| On-chip RAM | 1,152 Kbits | — |
| Embedded Multipliers | 1,728 18x18 | — |
| PLLs | 8 | [DATA_NEEDED: number of PLLs] |
| DLLs | 8 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100 C (I3 industrial) |
| Speed Grade | I3 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Arria II GZ |
| Logic Elements (LE) | — | 300000 |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Node | — | 40 nm |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| Level ng MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |