EP2AGZ225FF35I4G vs EP2AGZ225FF35C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I4G sa pamamagitan ng Intel at EP2AGZ225FF35C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I4G | EP2AGZ225FF35C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | ~224,000 LE | — |
| Process Node | 40 nm | 40 nm |
| Number of I/O | 554 user I/O | — |
| Package Type | 1152-ball FineLine BGA (FBGA) | — |
| Package Code | FF35 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | I4 | 3 |
| Volte ng Pagbibigay | [DATA_NEEDED: core VCC voltage] | — |
| Embedded Transceivers | Multi-gigabit (per datasheet) | — |
| DSP Blocks | Yes (per Arria II GZ family) | Yes (variable-precision) |
| Embedded Memory | Yes (per Arria II GZ family) | — |
| PCI Express Hard IP | Yes (Gen1/Gen2) | Gen1, Gen2 |
| External Memory Interface | DDR3 controller (per family) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Tindminan RoHS | Compliant (per distributor listing) | Compliant |
| Lead-Free | Yes (per distributor listing) | — |
| Logic Elements (LE) | — | 224,000 |
| Logic Array Blocks (LAB) | — | 8,960 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/Os | — | 554 |
| Packhaging | — | 1152-BBGA, FCBGA |
| Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Up to 12.5 Gbps |
| Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |