EP2AGZ225HF40C4G vs EP2AGZ350HF40C4G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225HF40C4G sa pamamagitan ng Intel at EP2AGZ350HF40C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ225HF40C4G EP2AGZ350HF40C4G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Logic Elements (LE) 225,000 350,000
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
Embedded Memory 12.5 Mbits (M9K blocks) —
18x18 Hardware Multipliers 1,224 —
PLLs [DATA_NEEDED: PLL count] 8 (fractional)
Transceivers 8 channels, up to 3.125 Gbps [DATA_NEEDED: transceiver channel count for HF40 package]
Maximum User I/O 734 606
Packhaging 1517-FBGA (FineLine BGA), 40 mm x 40 mm class FBGA-1517 (HF40)
Process Technology 40 nm TSMC low-power CMOS —
Core Voltage (Vcc) 0.85 V (typical, speed grade C4) —
Speed Grade C4 (commercial, mid-performance) 4
Temperature na Operasyon 0C to +85C (commercial) 0C to +85C (Commercial)
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng MSL 3 (168 hours) —
Tindminan RoHS Compliant —
Family — Arria II GZ
Embedded Memory (bits) — 20,480 Kbits
User Accessible RAM (bits) — 4.7 Mbits
DSP Blocks — 534 (18x18 multipliers)
Transceiver Data Rate — up to 3.125 Gbps
Hard Memory Controllers — Yes (DDR3, DDR2, QDR)
Hard PCIe Gen2 Endpoint — Yes
Process Node — 40 nm
Pitch — 1.0 mm
Lead-Free / RoHS — Lead-Free / RoHS Compliant
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita