EP2AGZ225HF40C4N vs EP2AGZ225HF40C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225HF40C4N sa pamamagitan ng Intel at EP2AGZ225HF40C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGZ225HF40C3G - 225K LE Arria II GZ FPGA, 734 I/O, FBGA-1517 | Intel
EP2AGZ225HF40C3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGZ225HF40C4N | EP2AGZ225HF40C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | 225,000 |
| Logic Array Blocks (LABs) | 8,960 | — |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | — |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | — |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | [DATA_NEEDED: count and width] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| User I/O Count | — | 734 |
| Packhaging | — | 1517-ball FBGA (HF40) |
| Process Technology | — | 40 nm |
| Temperature na Operasyon | — | Commercial (0C to +85C) |
| Speed Grade | — | C3 |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core voltage] |
| Embedded Memory | — | [DATA_NEEDED: total Mbits] |
| Transceivers | — | [DATA_NEEDED: count and max data rate] |
| PCIe Hard IP | — | [DATA_NEEDED: PCIe Gen1/Gen2 lanes] |
| Configuration Scheme | — | [DATA_NEEDED: AS, PS, JTAG] |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Lead-Free | — | Yes |