EP2AGZ300FF35C3N vs EP2AGZ225FF35C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35C3N sa pamamagitan ng Intel at EP2AGZ225FF35C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35C3N | EP2AGZ225FF35C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | 224,000 |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | 554 |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | Up to 12.5 Gbps |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| PLLs | 8 | — |
| Packhaging | 1152-ball FCBGA (FF35) | 1152-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial | — |
| Logic Array Blocks (LAB) | — | 8,960 |
| Embedded Memory (bits) | — | 14,248,960 |
| Process Node | — | 40 nm |
| Speed Grade | — | 3 |
| Temperature Grade | — | Commercial (0C to +85C) |
| DSP Blocks | — | Yes (variable-precision) |
| Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |
| PCI Express Hard IP | — | Gen1, Gen2 |
| Tindminan RoHS | — | Compliant |