EP2AGZ300FF35C4N vs EP2AGZ300FF35I4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35C4N sa pamamagitan ng Altera at EP2AGZ300FF35I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FF35C4N EP2AGZ300FF35I4N
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Series Arria II GZ Arria II GZ
Logic Elements 298,000 298,000
Logic Array Blocks (LABs) 11,920 —
Embedded Memory (bits) 18,854,912 (~17.9 Mbit) —
User I/O Count 554 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 40 nm 40 nm
Core Voltage 0.9 V —
Package Type 1152-BBGA, FCBGA (flip-chip) 1152-BBGA, FCBGA
Terminal Form Ball —
Package Code (JEDEC) HBGA —
Operating Temperature Grade Commercial (C4 = 0C to +85C) —
Configuration Memory SRAM-based (volatile, requires boot device) —
Transceivers Multi-gigabit transceivers integrated —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
PLLs [DATA_NEEDED: PLL count] —
Tindminan RoHS Compliant (per Besenchips / DigiKey listing) Compliant
Lead-Free Status Lead free (per Besenchips listing) —
Uri ng Pagpapasok Surface Mount Surface Mount
Maximum Operating Frequency 500 MHz —
Family — Field Programmable Gate Array (FPGA)
Number of LABs/CLBs — 11,920
Total RAM Bits — 18,854,912 bits
Number of I/O — 554
Supply Voltage Core — 0.9 V
Temperature na Operasyon — -40C to +100C (Industrial)
Package Dimensions — 35 mm x 35 mm
Supplier Device Package — 1152-FBGA (35x35)
Lead-Free — Yes

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