EP2AGZ300FF35I3G vs EP2AGZ300FF35I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I3G sa pamamagitan ng Intel at EP2AGZ300FF35I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35I3G | EP2AGZ300FF35I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 300000 | — |
| Number of User I/O | 554 (maximum) | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Process Node | 40 nm | — |
| Temperature na Operasyon | -40C to +100 C (I3 industrial) | -40C to +100C (Industrial) |
| Packhaging | 1152-ball FBGA (FF35) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Volte ng Pagbibigay | [DATA_NEEDED: core and I/O supply voltage values] | — |
| Embedded Memory (Mbits) | 16.4 | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | — |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| Memory Interfaces | DDR3, QDRII+, RLDRAM II | — |
| Configuration Method | Serial, Parallel, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Lead-Free | Yes | Yes |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| Number of LABs/CLBs | — | 11,920 |
| Total RAM Bits | — | 18,854,912 bits |
| Number of I/O | — | 554 |
| Supply Voltage Core | — | 0.9 V |
| Process Technology | — | 40 nm |
| Package Type | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Supplier Device Package | — | 1152-FBGA (35x35) |