EP2AGZ300FH29C4N vs EP2AGZ300FH29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C4N sa pamamagitan ng Intel at EP2AGZ300FH29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel
EP2AGZ300FH29I3N ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29C4N | EP2AGZ300FH29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Tapus ng Buhay |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Adaptive Logic Modules (ALMs) | 119,200 | — |
| Embedded Memory (bits) | 18,854,912 | — |
| User I/O Pins | 281 | 281 |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | — |
| Transceivers | Up to 28 (up to 6.375 Gbps) | 12 |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | 40 nm |
| Packhaging | 780-ball FC-HFBGA (FH29) | 780-FCBGA (H-BGA, 29x29 mm) |
| Speed Grade | C4 | I3 |
| Temperature Grade | Industrial (N suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 298,000 |
| Embedded Memory | — | 18,854,912 bits |
| Max Transceiver Speed | — | 6.375 Gbps |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| PLLs | — | 8 (4 general-purpose + 4 transceiver) |
| Global Clock Networks | — | 16 |
| Katayuan ng Lifecycle | — | End of Life (EOL) |