EP2AGZ350FF35C3G vs EP2AGZ300FF35I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35C3G sa pamamagitan ng Altera at EP2AGZ300FF35I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35C3G | EP2AGZ300FF35I3G |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 350,000 | 300000 |
| Embedded Memory | 16,860 Kbits | — |
| DSP Blocks (18x18 Multipliers) | 224 | — |
| Transceivers | 8 | — |
| Transceiver Data Rate | up to 6.375 Gbps | Up to 6.375 Gbps |
| User I/O Pins | 554 | — |
| PLLs | 8 | [DATA_NEEDED: number of PLLs] |
| Hard Memory Controllers | 2 | — |
| Memory Interface Support | DDR3, DDR2, QDR II+, RLDRAM II | — |
| Maximum Memory Clock | 800 MHz | — |
| Process Node | 40 nm TSMC | 40 nm |
| Packhaging | 1152-FBGA (35 mm x 35 mm, 1.0 mm pitch) | 1152-ball FBGA (FF35) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100 C (I3 industrial) |
| Core Voltage | 0.9 V | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AS | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| Level ng MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |