EP2AGZ350FF35C3N vs EP2AGZ225FF35C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35C3N sa pamamagitan ng Intel at EP2AGZ225FF35C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35C3N | EP2AGZ225FF35C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348500 | — |
| Logic Array Blocks (LABs) | 13940 | — |
| Embedded Memory Bits | 21270528 | — |
| Number of I/O Pins | 554 | — |
| Core Voltage | 0.9 V | — |
| Maximum Core Frequency | 500 MHz | — |
| Process Technology | 40 nm CMOS | — |
| Packhaging | 1152-BBGA, FC-FBGA (35 x 35 mm) | 1152-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead Free | Yes (per MS-034) | — |
| MSL Rating | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Grade | Commercial (0C to +85C typical) | — |
| Transceivers | Multi-gigigabit transceivers (family-rated) | Up to 12.5 Gbps |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Logic Elements (LE) | — | 224,000 |
| Logic Array Blocks (LAB) | — | 8,960 |
| Embedded Memory (bits) | — | 14,248,960 |
| User I/Os | — | 554 |
| Process Node | — | 40 nm |
| Speed Grade | — | 3 |
| Temperature Grade | — | Commercial (0C to +85C) |
| DSP Blocks | — | Yes (variable-precision) |
| Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |
| PCI Express Hard IP | — | Gen1, Gen2 |