EP2AGZ350FF35C3N vs EP2AGZ300FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35C3N sa pamamagitan ng Intel at EP2AGZ300FF35C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35C3N | EP2AGZ300FF35C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Arria II GZ | — |
| Logic Elements | 348500 | 298,000 |
| Logic Array Blocks (LABs) | 13940 | 11,920 |
| Embedded Memory Bits | 21270528 | — |
| Number of I/O Pins | 554 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Maximum Core Frequency | 500 MHz | — |
| Process Technology | 40 nm CMOS | 40 nm |
| Packhaging | 1152-BBGA, FC-FBGA (35 x 35 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free | Yes (per MS-034) | — |
| MSL Rating | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Grade | Commercial (0C to +85C typical) | Commercial (C4 = 0C to +85C) |
| Transceivers | Multi-gigigabit transceivers (family-rated) | Multi-gigabit transceivers integrated |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant (per Besenchips / DigiKey listing) |
| Series | — | Arria II GZ |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |