EP2AGZ350FF35C4N vs EP2AGZ350FF35I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35C4N sa pamamagitan ng Intel at EP2AGZ350FF35I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35C4N | EP2AGZ350FF35I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 348,500 | — |
| Logic Array Blocks (LABs) | 13,940 | — |
| Embedded Memory (bits) | 21,270,528 | — |
| User I/Os | 554 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Maximum Fabric Frequency | 500 MHz | — |
| Packhaging | 1152-ball FC-FBGA | 1152-BBGA, FCBGA |
| Package Dimensions | 35 x 35 mm | — |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | — |
| Temperature na Operasyon | Commercial (0C to +85C) | -40C to +100C (Industrial) |
| Speed Grade | C4 | I3 |
| Lead-Free / RoHS | Lead Free | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL Level] |
| Logic Elements | — | 350,000 |
| Embedded Memory (Bits) | — | 21,270,528 |
| Embedded RAM | — | 17.4 Mbit |
| User I/O | — | 554 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers (per Arria II GZ family) |
| DSP Blocks | — | Yes, variable-precision |
| Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM II |
| Hard IP | — | PCIe Gen2, 10GbE MAC |
| Configuration | — | Passive Serial, Fast Passive Parallel, JTAG |
| Tindminan RoHS | — | Compliant (Pb-free, G) |
| Lead-Free | — | Yes |
| Volte ng Pagbibigay | — | [DATA_NEEDED: Core/IO supply] |