EP2AGZ350FF35I3N vs EP2AGZ225FF35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35I3N sa pamamagitan ng Altera at EP2AGZ225FF35I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera
EP2AGZ350FF35I3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35I3N | EP2AGZ225FF35I3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Logic Array Blocks (LABs) | 13,940 | 8,960 |
| Embedded Memory (bits) | 21,270,528 | — |
| User I/Os | 554 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Packhaging | 1152-ball FC-FBGA (Flip-Chip FineLine BGA) | 1152-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements (LE) | — | 224,000 |
| Embedded Memory | — | 14,248,960 bits (approx. 14.25 Mbit) |
| User I/O Count | — | 554 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |
| Maximum User I/O | — | 554 |