EP2AGZ350FF35I4 vs EP2AGZ350FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FF35I4 sa pamamagitan ng Intel at EP2AGZ350FF35C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FF35I4 | EP2AGZ350FF35C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | — |
| Adaptive Logic Modules (ALMs) | 139,400 | — |
| Logic Array Blocks (LABs) | 13,940 | 13,940 |
| Embedded Memory | 21,270,528 bits (~21.27 Mbit) | — |
| User I/O Pins | 554 | — |
| DSP Blocks | Variable-precision 18x18 multipliers | — |
| Transceivers | Up to 16 channels, 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) | 1152-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Operating Temperature (TJ) | -40C to +100C (Industrial) | — |
| Tindminan RoHS | Compliant | — |
| Lead Free | Yes | — |
| Logic Elements (LE) | — | 348,500 |
| Embedded Memory (bits) | — | 21,270,528 |
| User I/Os | — | 554 |
| Maximum Fabric Frequency | — | 500 MHz |
| Package Dimensions | — | 35 x 35 mm |
| Temperature na Operasyon | — | Commercial (0C to +85C) |
| Speed Grade | — | C4 |
| Lead-Free / RoHS | — | Lead Free |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |