EP2AGZ350HF40C2N vs EP2AGZ225HF40C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C2N sa pamamagitan ng Altera at EP2AGZ225HF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGZ225HF40C3N - Arria II GZ 224K LE FPGA, 734 I/O | Intel FPGA
EP2AGZ225HF40C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40C2N | EP2AGZ225HF40C3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350,000 | 224000 |
| Embedded Memory | approximately 20 Mbits | — |
| DSP Blocks | Dedicated 18x18 multipliers | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 16 channels | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Packhaging | 1517-ball FCBGA (HF40), 40 mm x 40 mm | — |
| Speed Grade | C2 (commercial) | — |
| Temperature na Operasyon | 0C to +85C (commercial, per N suffix) | — |
| Process Node | 40 nm low-power | 40 nm |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, differential standards | — |
| External Memory Support | DDR3, QDR II+, RLDRAM II | — |
| Configuration Method | Quartus II design suite, JTAG, passive/active serial | — |
| Tindminan RoHS | Compliant (per product listing) | [DATA_NEEDED: rohs status] |
| Uri ng Pagpapasok | Surface Mount (FCBGA) | Surface Mount |
| Embedded Memory (bits) | — | 14248960 |
| Logic Array Blocks (LABs) | — | 8960 |
| User I/O Pins | — | 734 |
| Bilang ng Pins | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| Level ng MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Operating Temperature Grade | — | Industrial |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |