EP2AGZ350HF40C3G vs EP2AGZ350HF40C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C3G sa pamamagitan ng Intel at EP2AGZ350HF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
EP2AGZ350HF40C3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40C3G | EP2AGZ350HF40C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 350,000 | — |
| Embedded Memory | [DATA_NEEDED: total embedded memory bits] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count and 18x18 multiplier count] | [DATA_NEEDED: DSP block count] |
| User I/O Pins | 734 | — |
| Packhaging | 1517-ball FineLine BGA (HF40) | 1517-ball FCBGA (HF40) |
| Package Pitch | 1.0 mm | — |
| Process Node | 40 nm | — |
| Speed Grade | C3 (commercial, -3) | — |
| Temperature na Operasyon | Commercial (0C to 85C, suffix 0C) | — |
| Transceivers | Up to 6.375 Gbps (channel count [DATA_NEEDED]) | Up to 24 (per family datasheet) |
| External Memory Interfaces | DDR3, DDR2, QDR II+ (up to 800 MHz) | — |
| PCI Express Hard Blocks | Yes (Gen1/Gen2) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Logic Elements | — | 348,500 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Logic Array Blocks (LABs) | — | 13,940 |
| Embedded Memory Bits | — | 21,270,528 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K count] |
| User I/Os | — | 734 |
| Transceiver Data Rate | — | Up to 6.553 Gbps |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm low-power |
| Operating Temperature Grade | — | Commercial (C3) |
| Configuration Mode | — | FPP / AS / JTAG |