EP2AGZ350HF40C4N vs EP2AGZ350HF40C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C4N sa pamamagitan ng Intel at EP2AGZ350HF40C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ350HF40C4N EP2AGZ350HF40C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Logic Elements 348,500 —
Logic Array Blocks (LABs) 13,940 —
Embedded Memory Bits 21,270,528 (~21.27 Mbit) —
User I/O Pins 734 734
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Speed Grade C4 C3 (commercial, -3)
Temperature Grade Commercial (0C to +85C) —
Packhaging 1517-ball FC-FBGA (HF40, 40 x 40 mm) 1517-ball FineLine BGA (HF40)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Transceivers Up to 24 channels, up to 6.375 Gbps (per family datasheet) Up to 6.375 Gbps (channel count [DATA_NEEDED])
DSP Blocks Yes (18 x 18 multipliers, per family datasheet) [DATA_NEEDED: DSP block count and 18x18 multiplier count]
PLLs Fractional and integer PLLs (per family datasheet) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Level ng MSL [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL rating]
Tindminan RoHS Compliant (per Altera/Intel product page) Compliant
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 350,000
Embedded Memory — [DATA_NEEDED: total embedded memory bits]
Package Pitch — 1.0 mm
Process Node — 40 nm
Temperature na Operasyon — Commercial (0C to 85C, suffix 0C)
External Memory Interfaces — DDR3, DDR2, QDR II+ (up to 800 MHz)
PCI Express Hard Blocks — Yes (Gen1/Gen2)
Lead-Free — Yes

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