EP2AGZ350HF40I2N vs EP2AGZ350HF40I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40I2N sa pamamagitan ng Intel at EP2AGZ350HF40I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40I2N | EP2AGZ350HF40I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 348,500 |
| Packhaging | 1517-pin FBGA (HF40) | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| Transceivers | Embedded multi-gigabit transceivers | 24 channels up to 6.375 Gbps |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (18x18 multipliers) |
| Embedded Memory | [DATA_NEEDED: Mbits] | — |
| User I/O Banks | [DATA_NEEDED: bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Node | [DATA_NEEDED: process node nm] | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| AEC-Q100 | not_applicable | — |
| Adaptive Logic Modules (ALMs) | — | 139,400 |
| Embedded Memory Bits | — | 21,270,528 bits |
| Embedded Memory Blocks | — | 950 M20K blocks |
| User I/O Pins | — | 13,940 |
| Hard PCIe Controllers | — | 4 x Gen2 |
| Hard Memory Controllers | — | 8 DDR3 controllers up to 800 MHz |
| PLLs | — | 16 (8 fPLL + 8 GPLL) |
| Process Technology | — | 40 nm TSMC |
| Core Voltage | — | 0.9 V |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |